bonding technology

基本解释

An equipment for vacuum wafer bonding was developed based on the wafer bonding technology.
摘要基于圆片键合技术，设计了一种在真空条件下进行圆片键合的工艺设备。
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Bonding technology has been widely applied to the manufacture of bus and become an important part of the manufacture of bus.
粘接技术已经广泛应用于大客车的生产，并成为客车生产的重要组成环节。
But smoke and dust produced by bonding technology bring damage to the working environment gravely , endanger people's health .
然而伴随焊接工艺所产生的烟尘对劳动环境造成严重污染，危及人们的健康。

Today, the Commerce Department is informing the member nations of the Coordinating Committee on Multilateral Export Controls (COCOM) that the United States will decontrol the sale of wire-bonding technology to "proscribed destinations, " i.e. the Warsaw Pact.
CENTERFORSECURITYPOLICY: Center For Security Policy
The increasing sophistication of filters that can send brand-love messages exactly to that special consumer-someone in the mood for a little emotional bonding promised a land of sales on the other side, with technology enabling advertisers access to ever-more sophisticated profiles built from searches and social pages, selling this to brands as a way in.
FORBES: A Story About Occupying Digital Space. Or an Answer to 'How Should I Be Measuring Digital and Social Media Anyhow?'

键合技术
Wafer bonding technology is a process that two clean and flat wafers are jointed with chemical bonds on wafer surfaces in a required condition.
两个表面平整洁净的硅片在一定条件下可以通过表面的化学键互相连接起来,这就是硅硅直接键合技术。
封装工艺